BRESSNER Technology is expanding its portfolio of industrial flash storage solutions with the new ATP e.MMC Smaller Footprint series. With a form factor of just 6.7 mm, the series sets new standards in miniaturization and enables new design possibilities for space-constrained applications such as smart wearables, edge devices, and compact embedded systems.

As a system integrator and value-added distributor, BRESSNER Technology provides its customers with access to this innovative storage technology and supports integration into customized system architectures.

Ultra-compact Design for Maximum Design Flexibility

The new e.MMC modules of the E700Pc and E600Vc series are based on a 125-ball FBGA package and are up to 67% smaller than conventional e.MMC solutions. With a height of only 0.65 mm, they are ideally suited for particularly slim devices such as smart glasses or other compact embedded applications where every millimeter matters.

Despite the compact form factor, performance remains at a high level: the modules support the JEDEC e.MMC 5.1 standard (HS400) and achieve data rates of up to 400 MB/s.

High Energy Efficiency for Mobile and Battery-powered Systems

A key feature of the new series is the optimized firmware, which enables fast switching between active and idle mode. This allows energy savings of up to 70% – a clear advantage for mobile and battery-powered applications where runtime and thermal budgeting play a central role.

Maximilian Kopp, Account Manager for flash storage solutions at BRESSNER Technology, explains:

 “With the new e.MMC Smaller Footprint series, we offer our customers a state-of-the-art storage solution specifically designed for the requirements of compact and energy-efficient systems. Especially in the areas of wearables and edge AI, this opens up new possibilities in product design.”

Variants for Different Requirements

The series is available in different versions and therefore covers a range of application profiles:

• E600Vc (3D TLC) with 64 GB for classic embedded applications
• E700Pc (pSLC mode) with 20 GB for high write workloads and a lifespan of up to 680 TBW

Advanced technologies such as Error Correction, Wear Leveling as well as Auto and Dynamic Data Refresh ensure high data integrity and extend service life even under intensive use.

Designed for Industrial Operating Conditions

The ATP e.MMC Smaller Footprint series is engineered for operation in demanding environments. It supports an extended temperature range of -25 °C to +85 °C and, thanks to the soldered design, offers high vibration resistance. This makes it suitable for industrial, mobile, and outdoor applications where mechanical stress and temperature fluctuations are part of everyday operation.

Conclusion: Compact, Efficient, Long-lasting

With the ATP e.MMC Smaller Footprint series, developers and product teams get a storage platform that combines miniaturization, performance, and energy efficiency – without compromising on ruggedness and data integrity. For wearables, compact embedded systems, and edge devices, this opens up new room for maneuver in design and long-term operational reliability.

👉 View the ATP e.MMC Smaller Footprint series now in the BRESSNER Shop 

👉 Project planned? Discuss e.MMC selection and integration with our experts here with no obligation