- AMD Ryzen™ V1000 CPU
- Radeon™ RX Vega with 8 CU and 11 CU
- Sturdy design
- MezIO™-compatible
- Operating temp.: -25 °C to 70 °C
POC-500 Series
excl. 19% VAT zzgl. Versandkosten
Processor & Graphic:
- AMD Ryzen™ embedded V1605B CPU (POC-515)
- AMD Ryzen™ embedded V1807B CPU (POC-545)
- Graphics:
- Radeon™ RX Vega GPU with 8 compute units (POC-515)
- Radeon™ RX Vega GPU with 11 compute units (POC-545)
Memory:
- 1x SODIMM socket for DDR4-2400, up to 16GB (POC-515)
- 1x SODIMM socket for DDR4-3200, up to 16GB (POC-545)
- 1x M.2 2280 M key NVMe socket (PCIe Gen3 x2) for NVMe SSD installation
Features:
- 4x Gigabit Ethernet ports by Intel® I350-AM4 controller with screw-lock
- IEEE 802.3at PoE+ on port #1~ 4
- 4x USB 3.0 ports with screw-lock
- 1x VGA connector
- 1x DisplayPort connector
- 1x RS-232/ 422/ 485 ports (COM1)
- 3x 3-wire RS-232 ports (COM2/ 3/ 4) or 1x RS-422/ 485 port(COM2)
- 1x 3.5mm jack for mic-in and speaker-out
Expansion Slots:
- 1x full-size mini PCI Express socket with internal SIM socket
- 1x MezIO™ expansion interface for Neousys MezIO™ modules
Temperature and environment:
- Operating Temp.: -25°C ~ 70°C*/**
- Storage Temp.: -40°C ~85°C
- Humidity: 10%~90% , non-condensing
- Vibration: Operating, MIL-STD-810G, Method 514.6, Category 4
- Shock: Operating, MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II
Dimensions and Weight:
- POC-515:
- 64(W) x116(D) x176(H) mm
- 1.2kg
- POC-545:
- 81(W) x118(D) x176(H) mm
- 1.4kg
- External-accessible 80mm x 80mm fan for system heat dissipation
Mounting:
- DIN-rail mount (standard)
- Wall-mount (optional)
Certifications:
- CE/ FCC Class A, according to EN 55032 & EN 55024
Description
Strong computing power and robust design
The POC-500 series is equipped with an AMD Ryzen™ Embedded V1000 processor with 4 cores/8 threads. The built-in GPU delivers a performance of 3.6 TFLOPS in the FP16 benchmark test. Especially on the POC-500 series, that an M.2 2280 NVMe-SSD (PCIe Gen3 x2) is integrated in this compact device.
The POC-500 series can be DIN rail mounted and has numerous I/O ports accessible from the front panel. In addition, despite its compact design of 63 x 176 x 116 mm, the series offers 4 PoE+ ports, 4 USB 3.0 ports and 4 COM ports. The data ports are also equipped with a screw mechanism that prevents the cables from being pulled out. Within the POC-500 series, a choice can be made between two CPUs: the V1807B (45 W) variant is designed for the highest computing power requirements, and the V1605B (15 W) variant is specially designed for fanless operation in harsh operating environments.
The POC-500 is a series of ultra-compact embedded controllers with a special I/O design that is particularly robust and offers significantly more CPU or GPU power, making it ideal for a wide range of applications.
Supported MezIO™ modules
The MezIO™ module processes both computer signals (data bus) and control signals via a high-speed connection. It also has a power supply. This module makes the POC-500 series an application-specific system with application-oriented I/O components such as RS-232/422/485, isolated DIO and ignition control.
Additional information
| Weight | 8 kg |
|---|---|
| Dimensions | 45 × 20 × 12 cm |
| Steckplätze (Box-PC) | PCI, PCI Express |
| Temperatur (BOX-PC) | Standard Temp. |
| Prozessor (Box-PC) | Intel ® Core i5 | i7, Intel ® Xeon ® |
| Anschlüsse (Box-PC) | VGA, DVI, Display Port, CFast, 3G/4G |
Product variants:
POC-515: AMD Ryzen™ embedded V1605B ultra-compact controller with 4x PoE+ ports, 4x USB 3.0 ports and MezIO™ interface
POC-516: AMD Ryzen™ embedded V1605B ultra-compact controller with 4x PoE+ ports, 4x USB 3.0 ports and MezIO-R12
POC-545: AMD Ryzen™ embedded V1807B ultra-compact controller with 4x PoE+ ports, 4x USB 3.0 ports and MezIO™ interface
POC-546: AMD Ryzen™ embedded V1807B ultra-compact controller with 4x PoE+ ports, 4x USB 3.0 ports and MezIO-R12
