- Intel® 9. Gen/8. Gen Core™-LGA1151-CPU
- up to 64 GB DDR4 2666/ 2400 SDRAM
- 2x 2.5″ SATA Ports for HDD/ SSD
- 2x PCIe x16 Slots
- MezIO™-Port
Nuvo-7166GC Series
excl. 19% VAT zzgl. Versandkosten
Processor & Graphic:
- Processor:
-
- Intel® 9. Gen/8. Gen CPU (LGA1151 socket, 65W/ 35W TDP)
- Intel® Core™ i7-8700/ i7-8700T/ i7-9700E/ i7-9700TE
- Intel® Core™ i5-8500/ i5-8500T/ i5-9500E/ i5-9500TE
- Intel® Core™ i3-8100/ i3-8100T/ i3-9100E/ i3-9100TE
- Intel® UHD Graphics 630
- Intel® Q370 Chipset
Memory:
- up to 64 GB DDR4 2666/ 2400 SDRAM (two SODIMM slots)
- 2x internal SATA Ports for 2.5″ HDD/ SSD Installation, supports RAID 0/1
- 1x M.2 2280 M key NVMe socket (PCIe Gen3/ x4) for NVMe SSD installation
- 1x Full-Size mSATA Port (mux with mini-PCIe)
Features:
- 6x Gigabit Ethernet Ports I219 and 5x I210
- Optional IEEE 802.3at PoE+ PSE for Port 3 ~ Port 6 // 100 W total
- 4x USB 3.1 Gen2 (10 Gbps) Ports
- 4x USB 3.1 Gen1 (5 Gbps) Ports
- 1x VGA
- 1x DVI-D
- 1x DisplayPort
- 2x RS-232/ 422/ 485 Ports (COM1/ COM2)
- 2x RS-232 ports (COM3/ COM4)
- 1x 3.5 mm jack Mic-In and Speaker-Out
Expansion Slots:
- 2x PCIe x16 slot@Gen3, 8-lanes PCIe signal in Cassette for installing NVIDIA® Tesla T4 GPU and one additional PCIe card
- 1x full-size mini PCI Express socket with internal SIM socket (mux with mSATA)
- 1x M.2 2242 B key socket with dual front-accessible SIM sockets, supporting dual SIM mode with selected M.2 LTE module
- 1x MezIO™ expansion port for Neousys MezIO™ modules
Temperature and environment:
- Operating temp. mit 35W CPU:
- -25°C ~ 60°C **
- Operating temp. mit >= 65W CPU:
- -25°C ~ 60°C */ ** (configured as 35W TDP mode)
- -25°C ~ 50°C */ ** (configured as 65W TDP mode)
- Storage temp.: -40°C ~85°C
- Hummidity: 10%~90% , non-condensing
- Vibration: Operating, MIL-STD-810G, Method 514.6, Category 4
- Shock: Operating, MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II
Dimensions and Weight:
- 240mm (B) x 225 mm (T) x 110.5 mm (H)
- 4.5 Kg
Mounting:
- Wall-mount mounting bracket or optional DIN-Rail mounting
Certifications:
- CE/FCC Class A, according to EN 55032 & EN 55024
* For i7-8700 running at 65W mode, the highest operating temperature shall be limited to 50°C and thermal throttling may occur when sustained full-loading applied. Users can configure CPU power in BIOS to obtain higher operating temperature.
**For sub-zero operating temperature, a wide temperature range HDD or Solid State Disk (SSD) is required.
Description
Strong computing power and robust design
The Nuvo-7166GC series is a range of robust AI Inference platforms with 2 PCIe slots. Each of these can accommodate an NVIDIA® Tesla T4 GPU for faster computation of inferences, enabling the platform to perform up to 8.1 TFLOPS in the FP32 benchmark and 130 TOPs in the INT8 benchmark for real-time inferencing based on a trained neural network model. With its Intel® 9th Gen/8th Gen Coffee Lake Core™ processor (6/8 cores) and 64 GB DDR4-2666 RAM, the platform offers a balanced ratio of CPU, GPU and memory performance.
The Nuvo-7166GC uses a patented cassette module with a specially designed ventilation channel that directs air from the air intake past the passive heat sink of the NVIDIA® Tesla T4 GPU. In the event that you equip the platform with a second high-performance PCIe card, the cassette module also has a second fan to provide the necessary airflow. The cooling design guarantees operation in ambient temperatures of up to 60°C even under continuous full load of CPU and GPU.
The system incorporates the latest I/O technologies to increase the overall flexibility, functionality and performance of the system. It features an M.2 NVMe interface for super-fast hard drive access and USB 3.1 Gen2, GbE and PoE ports for data transfer. The cartridge module also provides an additional Gen3 x8 PCIe slot for installing a high performance PCIe card. Alternatively, a variety of sensor and frame grabber cards are available for this slot.
With its combination of inferential computing power, powerful CPU and expansion capabilities, the Nuvo-7166GC is the perfect rugged platform for versatile edge AI applications.
Additional information
| Weight | 8 kg |
|---|---|
| Dimensions | 45 × 20 × 12 cm |
| Steckplätze (Box-PC) | PCI, PCI Express |
| Temperatur (BOX-PC) | Standard Temp. |
| Prozessor (Box-PC) | Intel® Core™ i7 | i5 | i3 |
| Anschlüsse (Box-PC) | VGA, DVI, Display Port, CFast, 3G/4G |
