MX1-10FEP-D

Fanless Embedded PCs with 9th / 8th Gen. Intel® Core™ / Xeon® CPUs

MX1-10FEP-D

  • 9th / 8th Gen Intel® Core™ / Xeon®
  • Intel® C246 Chipset
  • Dual SODIMMs up to 32GB DDR4
  • 1x DP / DVI-I / HDMI/ 2x COM
  • Dimension: 268x128x246 mm
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Processor & Graphic:

  • 9th & 8th Gen Intel® Coffee Lake Xeon LGA1151 Socket processor, 6-core TDP Max. 80W
  • 9th & 8th Gen Intel® Coffee Lake LGA1151 Socket Processor, Core i7/i5/i3 6-core TDP Max. 65W, Core i9 8-core TDP Max. 35W
  • Intel® C246 Chipset

Memory:

  • Max. 32GB (Xeon: ECC / Non-ECC; Core-i: Non-ECC) / DDR4 2666MHz / 2 x 260-pin SO-DIMM
  • 3 x 2.5 HDD / SSD (1x with removable HDD bay, 2x with internal HDD bracket) / 2 x mSATA

Features:

  • 2x RS232/422/485 (supports 5V / 12V)
  • 4x USB 3.1 Gen 2 (10 Gbps)
  • 2x USB 3.0
  • 2 x USB 2.0 ports
  • 1x USB 2.0 port (internal)
  • 1x Mic-in / 1 x Line-out
  • 1x PS/2
  • 1x 2-pin Terminal Block Remote Power Reset
  • 1x 3-pin Terminal Block Power Input
  • 1x 4-pin Terminal Block External Fan Connector
  • 1x 2-pin Terminal Block Remote Power on / off
  • 4x SMA antenna (optional for WiFi/LTE function)
  • 2x RJ-45 (Intel® I219-LM Giga LAN + I210-IT Giga LAN)
  • 1x HDMI 1.4 / 1x DisplayPort 1.2 / 1x DVI-I
  • 2x SIM card slots with cover

Expansion Slots:

  • Storage: M.2 2280 / 2260 / 2242 M Key (PCIe, SATA)
  • Storage/LTE/Wireless: 2x mPCIe Full / Half size (USB / PCIe / SATA) with SIM card holder
  • Wireless: M.2 2230 E Key (PCIe, USB)
  • PCIe slot : PCIe 3.0 x16, PCIe 3.0 x1 (option: 2x PCIe 3.0 x8)

Power input:

  • 9~48V wide range DC input with terminal block connectivity
  • 300W AC/DC adapter

Temperature:

  • 35W TDP processor: -40°C ~ 70°C
  • 51~65W TDP processor: -40°C ~ 50°C
  • 71~80W TDP processor: -40°C ~ 40°C

Dimensions:

  • Dimensions: 268 x 128 x 246 mm (W x H x D)

Certifications:

  • CE / FCC Class A / compliant with EN50155 & EN50121 / E-mark

Description

MX1-10FEP-D – Fanless robust design

The fanless embedded GPU computing platforms MX1-10FEP-D are based on Intel® Xeon® or Core ™ processors of the ninth or eighth generation and are optimized for applications in industrial automation and machine control. The MX1-10FEP-D combines high-performance computing, scalable functions and versatile interfaces as well as reliability in industrial quality on a fanless platform and offers reliable long-term operation for performance-critical applications in industrial automation, visualization and computing-intensive processes. The Embedded PC series consists of an industrial-grade robust design and supports DDR4 memory via dual SODIMM slots, either non-ECC or ECC.

High performance for industrial requirements

The embedded systems combine outstanding performance with extensive connectivity while being easy to operate. The robust housing enables use under harsh conditions. With the use of a LGA1151 socket, with optional Intel® Xeon® Coffee Lake or Core ™ i3, i5, i7 or even i9 processors of the current generation, the embedded computer focuses on high performance with minimal power consumption. Together with unique image and video processing power and efficient remote monitoring, the MX1-10FEP-D meets the requirements for use in critical applications with the highest standards of reliability. Proven areas of application in the industrial environment can be found, amongst others, in machine vision, motion sensors and system monitoring.

Flexible connection options and high resistance

The MX1-10FEP-D offers a DisplayPort 1.2, a DVI-I and an HDMI 1.4 connection in every version and is ideal for three independent displays, making it the perfect solution e.g. for digital signage or multimedia scenarios. Up to 32GB DDR4 RAM and three HDDs or SSDs can be installed via SATA III (as well as two mSATA modules). Temperature fluctuations in the extended range from -40 to +70 ° C (with 35W TDP processor) as well as shocks and vibrations, the industrial computers can withstand without any issues. The series can be operated with power supplies in a voltage range of 9-48V and thus offers flexibility for many different application scenarios. Four USB 3.1 ports, two USB 3.0 and two USB 2.0 ports, two RJ-45 and two COM ports also offer plenty of connection options for additional devices.

Additional information

Weight 8 kg
Dimensions 45 × 20 × 12 cm
Steckplätze (Box-PC)

PCI Express

Temperatur (BOX-PC)

Standard Temp., Extended Temp.

Prozessor (Box-PC)

Intel® Core™ i7 | i5 | i3, Intel ® Xeon ®

Anschlüsse (Box-PC)

DVI, Display Port, HDMI, 3G/4G

Datasheet: MX1-10FEP-D

MX1-10FEP-D-C246-FL:

  • PCIe x16 + x1 slot
  • Fanless design
  • Without AC/DC adapter

MX1-10FEP-D-C246-FL-AC300:

  • PCIe x16 + x1 slot
  • Fanless design
  • 300W AC / DC adapter

MX1-10FEP-D-C246-IF-AC300:

  • PCIe x16 + x1 slot
  • 2x internal system fans
  • 300W AC / DC adapter

MX1-10FEP-D-C246-IEF-AC300:

  • PCIe x16 + x1 slot
  • 2x internal system fans
  • 1x external system fans
  • 300W AC / DC adapter

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